Sounds like a neat project—wearable stress monitor, huh? Let’s dive in. What kind of sensor stack are you using? Are you already settled on a microcontroller, or are we hunting for something ultra‑low‑power? Also, how are you planning the alert mechanism—vibrate, LED, or maybe a tiny audio cue? Let me know where the real headaches are, and we’ll troubleshoot together.

Hey, love the stack you’ve picked—MAX30102, TMP117, nRF52832, and a tiny battery. Let’s chew through the pain points one by one. 1. **Power budgeting** The nRF’s power draw really hinges on how you slice the sleep–wake cycle. The BLE advertising interval of 1 s is generous; you could push it to 2 s or 3 s if your app can tolerate a bit of lag in notifications. Every millisecond of advertising burns ~30 µA at 3.3 V, so cutting that down saves a lot. For the vibration event, the CPU will wake in a few microseconds—watch‑dog timeouts are cheap if you keep the stack low. One trick: keep the CPU in an “idle” state rather than a full deep sleep when you’re waiting for a motion event. That way you can pull the watchdog faster but still get the energy hit. 2. **Signal noise** The MAX30102’s IR channel is the main culprit for motion artefacts. A simple first‑order low‑pass (cut‑off ~1 Hz) can do the job, but you’ll need to filter the raw data before you calculate HR. I’d also add a simple “heartbeat confidence” metric—if the peak‑to‑peak amplitude dips below a threshold or the variance spikes, flag it as unreliable and ignore that sample. The sensor’s built‑in FIFO can give you a 32‑sample window; you can discard windows with high noise before you even compute the FFT or cross‑correlation. 3. **Enclosure size** A 100 µAh Li‑Po is tight in a 1 cm³ case, especially with the LED, buzzer, and vibration motor. You might look at a 2 mm thick coin cell, but you’ll have to drop the battery to ~50–60 µAh. If you really want to keep the same energy budget, consider a “step‑down” buck‑boost that runs at 2.5 V instead of 3.3 V—some of the peripherals will tolerate that lower rail and you can squeeze a bit more space out of the battery. Another option is to move the LED and buzzer to a single “multi‑mode” component—there are tiny RGB‑LED modules that have a built‑in driver and can also act as a buzzer at high frequency. 4. **Temperature sensor** The TMP117 is great, but you only need a sample every minute or so for stress monitoring. You can piggyback on the same low‑power wake cycle you use for the MAX30102, or even read it in the same burst if you time it right. The sensor’s I²C clock is low‑speed; you can keep the bus clock at 100 kHz to save a bit more. 5. **BLE stack tuning** If you want to keep the advertising interval short, consider using the “advertising with connection parameters” feature of the Nordic SDK. That lets you advertise briefly, then immediately switch to a connected mode that keeps the CPU in a low‑power “connected idle” state. Also, the SDK’s “peer manager” can help you drop the power draw when you’re not actively streaming data. Bottom line: the biggest killers will be the BLE advertising and the vibration motor. If you keep the vibration to a single pulse and batch the BLE updates, you’ll shave off the majority of the draw. Anything else you’re worried about—like the exact wiring of the MAX30102 or how to keep the PCB stack‑up tidy? Let me know, and we’ll dig deeper.

Sounds solid so far—just a few wiring niceties to keep the noise low and the battery happy. - **I²C pull‑ups**: 1.8 kΩ on SDA/SCL to 2.5 V. The MAX30102 and TMP117 are fine with that, and it keeps the line fast enough for 50 kHz temp reads. - **Decoupling**: 0.1 µF ceramic next to each device’s VDD/GND pins, plus a 10 µF bulk cap on the 2.5 V rail. That snuffs out the LED driver spikes and the sensor’s power‑on glitches. - **LED driver**: Tie the MAX30102’s RED, IR, and GREEN pins to the MCU GPIOs that can source 10–20 mA. Add a 3–5 Ω series resistor per channel to limit current and keep the sensor happy. - **Ground plane**: Run a solid ground trace under the sensor and the MCU, and connect all grounds together at a single point to avoid loops. - **I²C line placement**: Keep SDA/SCL away from the vibration motor’s coil leads. A short, straight run reduces EMI pickup. - **Temperature sensor**: Mount the TMP117 close to the MCU and place its 10 µF cap directly on the sensor to keep the I²C bus clean. - **Power switching**: Use a low‑leakage P‑channel MOSFET to cut the 2.5 V rail to the sensors during deep sleep; the MCU can still pull the FET gate low to re‑enable them without a big voltage drop. That should give you a tidy stack‑up, low noise, and a good chance of hitting that full‑day target. Any other quirks you’re worried about?

Sounds like we’re good to go—just double‑check that MOSFET’s turn‑on time, and you might want a small ferrite bead on the vibration coil lead to keep any inductive surge away from the pull‑ups. Keep me posted on the first prototype; I’ll be on standby with a virtual multimeter. Happy soldering!