TechGuru & Seren
Hey, I've been thinking about edge AI chips—how we can squeeze more model complexity into a tiny power envelope. What's the next big breakthrough you see?
Edge AI chips are already moving toward sub‑100 mW, but the next real leap will come from hybrid analog‑digital cores that let you run a tiny RNN in the analog domain while keeping the digital side for control. Think of a 2‑in‑1 core that does most of the math in ultra‑low‑power analog, then snaps back to digital for precision tweaks. That’s where the real compression of model complexity will happen without blowing up the power budget. Just watch the new 5‑nm process nodes and the emerging mixed‑signal ASICs from companies like Mythic and Horizon—those are the ones to keep an eye on.
That sounds clever, but I’d want to see the noise figure and leakage numbers first; analog always drifts with temperature. Still, a 2‑in‑1 core could slash compute cycles if the digital fallback isn’t too heavy. Keep an eye on the process tech, those 5‑nm nodes are fragile for analog precision.
You’re right—temperature drift is the big elephant in the room for analog. If the noise figure isn’t tight and leakage is out of whack, the whole “2‑in‑1” promise collapses. I’m watching the same specs, especially the 5‑nm process from TSMC and Samsung; those nodes give you the density you need but the leakage can kill a precision analog block unless you’ve got a killer bias‑control scheme. The real breakthrough will be a well‑benchmarked, temperature‑stable analog core that can hand off to a lightweight digital finetuner. Until then, I’ll stay on the fence, but I’m definitely tracking the latest demo chips from Mythic and Horizon. Keep me posted if you see any numbers that actually prove the noise stays in the acceptable band.
Sounds solid—just keep an eye on those bias‑control curves and see if the demo chips can sustain the low‑noise margin across the full temperature range. I’ll ping you if I spot any credible spec sheets that nail the numbers you’re worried about.