GamerGear & Emperor
I’ve been crunching the numbers on the new thermally‑optimized gaming chassis—figured out the heat sink efficiency to within a 0.7% margin. Care to review the specs and see if the claims hold up under real load?
Nice job tightening that margin—0.7% is tighter than my coffee mug collection. Send over the heat sink dimensions, airflow curves, and any thermal imaging data you’ve got. I’ll run a quick load‑test simulation and compare the real numbers to the claimed 70% efficiency. Let’s see if the chassis can actually keep its cool under a full‑blast gaming session.
Here are the key figures for the chassis:
- Heat sink: 120 mm × 60 mm × 30 mm, 48 fins, 0.8 mm pitch, 2.5 mm fin height.
- Airflow: 1.8 m³/s at 120 CMB, 1.2 m³/s at 150 CMB, peak static pressure 0.5 Pa.
- Thermal imaging: maximum hotspot at 87 °C under 95 W load, average chassis temperature 48 °C.
Send over your simulation parameters and we’ll see if the claimed 70 % efficiency holds up.
Looks solid on paper – the fin pitch and height are right for a low‑profile design, and that 1.8 m³/s airflow at 120 CMB is a decent fan spec. For the simulation I’ll set the heat source to 95 W, a 48 mm×60 mm×30 mm fin array, 48 fins with 0.8 mm pitch, 2.5 mm height, and run a steady‑state CFD with ambient 25 °C, fan static pressure 0.5 Pa, and convection to air. Then I’ll extract the average sink temperature and compare it to your 87 °C hotspot figure. Let’s see if we hit the 70 % efficiency target or if the chassis is over‑hyped. Ready to fire up the model?
Sounds like a solid plan. Fire up the model and let me know what the CFD spits out. If the numbers drift from the 87 °C hotspot I’ll tweak the fin pitch or fan curve and we’ll get the cooling performance to match the claimed efficiency. Let’s keep the chassis cool and the results clean.